XC17S30PDG8C Image

XC17S30PDG8C

Product Category : XILINX CPLD FPGA IC

Description : Memory Circuit, 247968X1, CMOS, PDIP8 IC

Marketing Price : N/A

Our Price : Quote by Email

Datasheet : XC17S30PDG8C.pdf

  • Available Quantity : 5062 Pieces
  • Ships from : HONGKONG
  • Delivery Time : Ship within 1 day if urgen
  • Date code : Newest
  • Manufacturer lead time : 8-10 Weeks
  • Email : [email protected]
EIS is the stocking distributor of XC17S30PDG8C, we specialize in all series Xilinx components. XC17S30PDG8C can be shipped within 24 hours after order. If you have any demands for XC17S30PDG8C. Please kindly send an inquiry by email. Our email is [email protected].
Internal Part NumberEIS-XC17S30PDG8C
ConditionNew & Unused, Original Sealed
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC17S30PDG8C today
SeriesXC17S3
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.32.00.71
Number of CLBs-
Number of Terminals8
TechnologyCMOS
Feature247968X1
Package CodeDIP
Package ShapeRECTANGULAR
Package StyleIN-LINE Meter
Surface MountNO
Width7.62 mm
Length9.3599 mm
Moisture Sensitivity Level1
Peak Reflow Temperature (Cel)250
Combinatorial Delay of a CLB-Max-
alternatesXC17S30PD8C-1437682434,XC17S30PD8I-1437682437,XC17S30PDG8I-2040291845
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC17S30PDG8C
Alternative Part (Replacement)EIS-XC17S30PDG8C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC17S3, XC17S30PDG8C Datasheet